Typical Applications:

• ✔ High Power Inverters
• ✔ Chopper Induction Heating
• ✔ Forced Converters
• ✔ Soft Start Components

• Full diffusion process
• Flat ceramic tube packaging
• Distributed amplification gate structure
• Excellent dynamic characteristics
• Low switching loss
• Dual-sided cooling
• Fast switching performance

Using advanced monocrystalline silicon wafers combined with high-performance welding equipment, this module features high conductivity, high thermal conductivity, strong overcurrent capability, low voltage drop, and stable trigger current.

1. Relevant material check before production.
2. Full check after every individual process finished.
3. Full check after production half-done.
4. Spots check after production packed before shipping.